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最新推出無鉛中溫Sn/Bi/Cu合金錫膏—PF-3005-C

作者:張建斌 2021-10-19 0

綠志島金屬有限公司最新推出無鉛中溫Sn/Bi/Cu合金錫膏,型號:中溫錫膏PF-3005-C,具特性如下:

1. 熔點低(146190℃),焊接溫度接近錫鉛錫膏,對元器件和板材耐熱性要求低,生產工藝窗口大;

2. 相對于目前常用的無鉛合金錫膏(如Sn/Ag/CuSn/Bi/Ag),成本低;

3. 熱導性好,在散熱模組產品上應用此產品,其熱導率比Sn/Bi合金增高一倍左右;

4. 此合金機械強度接近Sn/Ag/Cu合金。

4. 此產品采用球形度好、顆粒度分布均勻的錫粉煉制而成,粘度適中,適應各種涂布方法;

5. 印刷滾動性、脫膜性及抗坍塌性均表現優良,可有效解決密間距和小元件的焊盤印刷;

6. 潤濕性好,能適應不同的金屬鍍層;焊后板面殘留極少且透明、阻抗高,焊點平滑飽滿;

7. 此款合金錫膏可作為Sn/Ag/Cu合金(表面貼裝和通孔涂布工藝)及Sn/Bi(散熱模組)類型產品的替代品;可有效地緩解焊料行業中對Ag需求的劇烈增加和避免無鉛的高溫焊接;解決了Sn/Bi焊料在散熱模組產品上的低熱導問題。


        Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.


附本錫膏應用案例:

1、應用于散熱器的焊接

2、應用于表面貼裝

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